So you want to push the IHS to the left if looking at it from the top, oriented with the little QR-Code towards the bottom. You do not want to push the IHS towards the SMD components, ALWAYS away from them.Īs you can see, there is one side that has no caps on it to the right. I found that with Xeons and the i7s SMDs are placed in the same shape around the die. Second IMPORTANT thing to know is the placement of SMDs underneath the IHS. No heating required! I did this 3x and all three CPUs came out alive and well.ĮDIT: 4/4 now, I´ll keep track of the number Gently but steadily increase pressure, avoid sudden movement and the IHS should just come off (remember that the CPU will drop, try to catch it with something soft underneath). Have one edge pressing on the IHS and one on the substrate. The first problem I encountered was, that the current delidding tools like the one from Der8auer are too small to fit the 1366 CPUs. There are other reasons to do it tho (I think some Mac Pro needs delidded chips). Right from the start I can tell you it is definitly NOT worth it for temperatures, I can not recommend doing it. I´m currently busy with 1366 CPUs and made some tests on delidding them even tho they are already soldered.
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